On June 9, Jiangxi Senping Technology Co., Ltd. (hereinafter referred to as “Senping Technology”) and LK Group’s large-scale intelligent die-casting unit strategic cooperation signing ceremony was held in LK Group Shenzhen Lingwei Technology Co., Ltd.
Leng Hongwei, Chairman of Senping Technology, Li Min, Chief Financial Officer, Mr. Liu Zhuoming, CEO of LK Group, and Ms. Pan Lingling, General Manager of LK Group Shenzhen Lingwei Technology Co., Ltd. attended the signing ceremony.
Mr. Liu Zhuoming, CEO of LK Group, delivered a speech.
Leng Hongwei, chairman of Senping Technology, delivered a speech.
Ms. Pan Lingling, general manager of LK Group Shenzhen Lingwei Technology Co., Ltd., and Leng Hongwei, chairman of Senping Technology, jointly signed a large-scale intelligent die-casting unit strategic cooperation agreement.
Leng Hongwei, chairman of Senping Technology, and his party visited LK’s large-scale intelligent die-casting unit assembly workshop.
Senping Technology is located in Jiangxi Pingxiang Economic and Technological Development Zone. It is China’s leading overall solution provider of precision semiconductor packaging consumables, specializing in the research and development, production and sales of semiconductor chip consumables.
In recent years, Senping Technology has invested in the construction of integrated die-casting of automotive precision parts, semiconductor packaging material research and development laboratory, six-axis robot automatic chip nozzle production line, six-axis robot automatic material box production line, etc. The production of semiconductor and LED packaging components Production line, deeply cultivated in the semiconductor packaging industry, and entered the field of integrated die-casting manufacturing of large-scale structural parts of new energy vehicles.
This time, Senping Technology has signed a contract to purchase 23 sets of Lijin large-scale intelligent die-casting units, covering 3500T, 4000T, 5000T, 6000T, 9000T, 12000T and other large-scale intelligent die-casting units, which will further enhance the product manufacturing strength of Senping Technology. Speeding up on the manufacturing track of automotive integrated die-casting structural parts and large structural parts in other industries.
At present, Senping Technology is transforming and developing from the semiconductor packaging consumables industry to the new energy automobile industry, and is striving to build an intelligent and unmanned manufacturing system for Industry 4.0. The large-scale intelligent green energy-saving die-casting unit developed by LK Group is widely used in automobile, 5G communication, home appliances and other industries. It has mature and reliable integrated die-casting technology for large-scale automotive structural parts, which meets the development needs of Senping Technology’s diversified business strategy.
Under the policy opportunities of insisting on innovation-driven development and expanding strategic emerging industries in the “14th Five-Year Plan”, in 2022, LK Group will speed up the research and development of super-large intelligent die-casting units and the layout of the intelligent manufacturing industry, and join hands with many die-casting industry chain enterprises. Build a development ecology and jointly promote the popularization and application of integrated die-casting technology for large-scale automotive structural parts.
At the same time, LK Group also accelerated the construction of the production base in the Shenzhen-Shantou Special Cooperation Zone, focused on improving the manufacturing capacity of large-scale intelligent die-casting units, and welcomed the arrival of the era of large-scale die-casting with leading innovative technologies and sufficient capacity manufacturing reserves!